SEMICOSIL® silicones are available as 1- and 2-component silicone rubbers, addition- or UV-curing. The curing methods and times can be individually adjusted by selecting the appropriate catalyst. All grades can be processed fully automatically in mixing and dosing units and are ideal for processing using conventional methods or in mass production. Selected grades are available as thermally conductive materials as adhesives, gap fillers and pastes. The products are characterized by precise control over the curing process. With the 1C and 2C silicones, users have the ability to precisely control the curing process by adjusting the mixing ratios of the two components. This allows customization to the specific requirements of the application.
>> WACKER brochure: Silicone Solution for Thermal Management_EN (PDF)
- Gap filler paste, thermal conductivity 3.0 W/mK
- No oil bleeding
- Constant properties from – 50 °C to +180 °C
- low stress, soft and tacky
- D4-D8 < 350 ppm
- Low abrasive
- Thixotropic
- Low pressure on the components
- Primerless adhesion
- Heat curing
- thixotropic
- transparent
- medium hardness
- high flexibility
- fast curing
- FIPG applications